As a Mechanical Thermal Design Engineer and member of a Collaboration Center Engineering team, you will be in a position to make important contributions to the design of platforms for Intel's customers and partners. Mechanical Thermal Engineers are primarily responsible for development of cooling solutions for next generation server systems. Server form factors will include rack, tower, and blade implementations. The successful candidate will partner with mechanical, thermal, and acoustical engineering team members to define thermal solutions from early concept to manufacture. Activities will include thermal simulations, airflow studies, fan selection, heat sink specification, and fan control development.
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly. All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
As a Mechanical Thermal Design Engineer and member of a Collaboration Center Engineering team, you will be in a position to make important contributions to the design of platforms for Intel's customers and partners. Mechanical Thermal Engineers are primarily responsible for development of cooling solutions for next generation server systems. Server form factors will include rack, tower, and blade implementations. The successful candidate will partner with mechanical, thermal, and acoustical engineering team members to define thermal solutions from early concept to manufacture. Activities will include thermal simulations, airflow studies, fan selection, heat sink specification, and fan control development.
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly. All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
www.intel.com/jobs/datacenter
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate must have a BS, MS or PhD in Mechanical Engineering, Physics or equivalent degree and:
- 6+ years experience with customer facing product development; product concept through sustaining
- 6+ years experience coaching and developing team members technically
- 6+ years experience with packaging of electronic assemblies using sheet metal, plastic injection molding, die casting.
- 4+ years experience with 3D modeling design using any modeling tools (tolerance analysis, failure analysis, fundamental engineering analysis)
Additional Preferred Qualifications:
- Experience in Thermal Simulations (CFD) and Finite Element Analysis (FEA) Acoustics and SI
- Familiarity with package and PCB layout tools
- Customer facing product development; product concept thru sustaining and developing/evolving product development processes
- Experience developing/evolving product development processes in a direct customer environment
- Experience in debug task forces to root cause and resolve complex system design issues
- Coaching and developing team members technically
- Excellent team player with good interpersonal and teamwork skills
- Strong problem solving, analytical, process improvement, organizational and data reduction skills
- Excellent communication skills
#DCGjobs
Job Category
Engineering
Primary Location
USA-Oregon, Hillsboro
Job Type
Experienced
Regular/Temporary
Regular
Posting Date
Apr 2, 2015
Business Group
The Datacenter and Connected Systems group drives new products technologies from high-end co-processors for supercomputers to low-energy systems for the cloud, as well as solutions for big data and intelligent devices. The group is a worldwide organization that develops the products and technologies that power nine of every 10 servers sold worldwide.
Posting Statement
Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate must have a BS, MS or PhD in Mechanical Engineering, Physics or equivalent degree and:
- 6+ years experience with customer facing product development; product concept through sustaining
- 6+ years experience coaching and developing team members technically
- 6+ years experience with packaging of electronic assemblies using sheet metal, plastic injection molding, die casting.
- 4+ years experience with 3D modeling design using any modeling tools (tolerance analysis, failure analysis, fundamental engineering analysis)
Additional Preferred Qualifications:
- Experience in Thermal Simulations (CFD) and Finite Element Analysis (FEA) Acoustics and SI
- Familiarity with package and PCB layout tools
- Customer facing product development; product concept thru sustaining and developing/evolving product development processes
- Experience developing/evolving product development processes in a direct customer environment
- Experience in debug task forces to root cause and resolve complex system design issues
- Coaching and developing team members technically
- Excellent team player with good interpersonal and teamwork skills
- Strong problem solving, analytical, process improvement, organizational and data reduction skills
- Excellent communication skills
Reference www.intel.com/jobs/datacenter
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly. All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
As a Mechanical Thermal Design Engineer and member of a Collaboration Center Engineering team, you will be in a position to make important contributions to the design of platforms for Intel's customers and partners. Mechanical Thermal Engineers are primarily responsible for development of cooling solutions for next generation server systems. Server form factors will include rack, tower, and blade implementations. The successful candidate will partner with mechanical, thermal, and acoustical engineering team members to define thermal solutions from early concept to manufacture. Activities will include thermal simulations, airflow studies, fan selection, heat sink specification, and fan control development.
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly. All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
www.intel.com/jobs/datacenter
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate must have a BS, MS or PhD in Mechanical Engineering, Physics or equivalent degree and:
- 6+ years experience with customer facing product development; product concept through sustaining
- 6+ years experience coaching and developing team members technically
- 6+ years experience with packaging of electronic assemblies using sheet metal, plastic injection molding, die casting.
- 4+ years experience with 3D modeling design using any modeling tools (tolerance analysis, failure analysis, fundamental engineering analysis)
Additional Preferred Qualifications:
- Experience in Thermal Simulations (CFD) and Finite Element Analysis (FEA) Acoustics and SI
- Familiarity with package and PCB layout tools
- Customer facing product development; product concept thru sustaining and developing/evolving product development processes
- Experience developing/evolving product development processes in a direct customer environment
- Experience in debug task forces to root cause and resolve complex system design issues
- Coaching and developing team members technically
- Excellent team player with good interpersonal and teamwork skills
- Strong problem solving, analytical, process improvement, organizational and data reduction skills
- Excellent communication skills
#DCGjobs
Job Category
Engineering
Primary Location
USA-Oregon, Hillsboro
Job Type
Experienced
Regular/Temporary
Regular
Posting Date
Apr 2, 2015
Business Group
The Datacenter and Connected Systems group drives new products technologies from high-end co-processors for supercomputers to low-energy systems for the cloud, as well as solutions for big data and intelligent devices. The group is a worldwide organization that develops the products and technologies that power nine of every 10 servers sold worldwide.
Posting Statement
Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
Candidates must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate must have a BS, MS or PhD in Mechanical Engineering, Physics or equivalent degree and:
- 6+ years experience with customer facing product development; product concept through sustaining
- 6+ years experience coaching and developing team members technically
- 6+ years experience with packaging of electronic assemblies using sheet metal, plastic injection molding, die casting.
- 4+ years experience with 3D modeling design using any modeling tools (tolerance analysis, failure analysis, fundamental engineering analysis)
Additional Preferred Qualifications:
- Experience in Thermal Simulations (CFD) and Finite Element Analysis (FEA) Acoustics and SI
- Familiarity with package and PCB layout tools
- Customer facing product development; product concept thru sustaining and developing/evolving product development processes
- Experience developing/evolving product development processes in a direct customer environment
- Experience in debug task forces to root cause and resolve complex system design issues
- Coaching and developing team members technically
- Excellent team player with good interpersonal and teamwork skills
- Strong problem solving, analytical, process improvement, organizational and data reduction skills
- Excellent communication skills
Reference www.intel.com/jobs/datacenter
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