As a Mechanical Thermal Design Engineer and member of a Collaboration Center Engineering team, you will be in a position to make important contributions to the design of platforms for Intel's customers and partners.
Mechanical Thermal Engineers are primarily responsible for development of cooling solutions for next generation server systems. Server form factors will include rack, tower, and blade implementations. The successful candidate will partner with mechanical, thermal, and acoustical engineering team members to define thermal solutions from early concept to manufacture. Activities will include thermal simulations, airflow studies, fan selection, heat sink specification, and fan control development.
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly.
All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
www.intel.com/jobs/datacenter
As a Mechanical Thermal Design Engineer and member of a Collaboration Center Engineering team, you will be in a position to make important contributions to the design of platforms for Intel's customers and partners.
Mechanical Thermal Engineers are primarily responsible for development of cooling solutions for next generation server systems. Server form factors will include rack, tower, and blade implementations. The successful candidate will partner with mechanical, thermal, and acoustical engineering team members to define thermal solutions from early concept to manufacture. Activities will include thermal simulations, airflow studies, fan selection, heat sink specification, and fan control development.
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly.
All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
www.intel.com/jobs/datacenter
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate Must Have a BS, MS Or PhD In Mechanical Engineering, Physics Or Equivalent Degree And
At least 4 years' experience with customer facing product development; product concept thru sustaining
At least 4 years' experience coaching and developing team members technically
At least 4 years' experience developing/evolving product development processes in a direct customer environment
At least 4 years' experience in debug task forces to root cause and resolve complex system design issues
At least 4 years' experience with packaging of electronic assemblies using sheet metal, plastic injection molding, die casting
At least 4 years' experience as a design engineer (ProE usage, tolerance analysis, failure analysis, fundamental engineering analysis)
Additional Preferred Qualifications
Experience in Thermal Simulations (CFD) and Finite Element Analysis (FEA)) Acoustics and SI
Familiarity with package and PCB layout tools
Customer facing product development; product concept thru sustaining and developing/evolving product development processes
Coaching and developing team members technically
Excellent team player with good interpersonal and teamwork skills
Strong problem solving, analytical, process improvement, organizational and data reduction skills
Excellent communication skills
Mechanical Thermal Engineers are primarily responsible for development of cooling solutions for next generation server systems. Server form factors will include rack, tower, and blade implementations. The successful candidate will partner with mechanical, thermal, and acoustical engineering team members to define thermal solutions from early concept to manufacture. Activities will include thermal simulations, airflow studies, fan selection, heat sink specification, and fan control development.
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly.
All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
www.intel.com/jobs/datacenter
As a Mechanical Thermal Design Engineer and member of a Collaboration Center Engineering team, you will be in a position to make important contributions to the design of platforms for Intel's customers and partners.
Mechanical Thermal Engineers are primarily responsible for development of cooling solutions for next generation server systems. Server form factors will include rack, tower, and blade implementations. The successful candidate will partner with mechanical, thermal, and acoustical engineering team members to define thermal solutions from early concept to manufacture. Activities will include thermal simulations, airflow studies, fan selection, heat sink specification, and fan control development.
Additional responsibilities include ensuring products achieve quality, feature set, cost, schedule, reliability, mechanical, acoustical, and regulatory/safety goals. Responsible for thermal design, component and system level thermal specifications, test plan creation, testing, data reduction, and status reporting for assigned and team projects. Successfully engineering multiple programs at one time as well as driving others, including external suppliers, to deliver robust thermal solutions.
Duties will include, but are not limited to, working closely with the customer's (and Intel's) supply chain for successful introduction of products, as well as day to day direct interactions with the Intel customer. Work with sheet metal, cast metal, injection plastic modeled part design, and testing of electronic systems. Additionally, technical design/development leadership and close customer interface on design commitments, including architecture, printed circuit board design, signal integrity modeling & simulation, test planning & test execution, debug & analysis, design documentation, problem solving, supplier liaison and design for manufacturability and assembly.
All team members establish and maintain effective, collaborative working relationships, including communication, data sharing and issue resolution strategies, between the collaboration center and external partners/customers.
www.intel.com/jobs/datacenter
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Candidate Must Have a BS, MS Or PhD In Mechanical Engineering, Physics Or Equivalent Degree And
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