Come intern with Intel's DCG (data center group). Intel is in the midst of an exciting transformation, going beyond being a company that makes the world's best chips to one that also delivers wonderful experiences for people.
With help from talented employees like you, we will tightly integrate hardware, software and services into compelling experiences in pursuit of our vision. This decade we will create and extend computing technology to connect and enrich the lives of every person on Earth.
About this position...
Intel Fabric Development Organization is seeking a summer engineering intern to join the Mechanical Design team in our King of Prussia design center. As a Mechanical Design Engineering intern, you will be exposed all aspects of the design, prototype, validation and documentation phases of product development. Our products are state of the art, high performance, high reliability, cost effective Fabric Platforms used in High Performance Computing (HPC) industry. HPC systems are used today to help solve some of the world's most challenging scientific needs, including fusion energy, bio-medical research, physics, as well as traditional engineering, such as aeronautic and automotive engineering.
What you will do...
Work with mechanical, electrical, thermal, and other engineering disciplines in developing platform/module/board level electronic hardware.
Evaluate prototypes, perform product validation testing.
Develop product/module design specifications and other documentation.
Support product qualification, compliance and regulatory testing.
Intern will be responsible for an individual project that utilize and grow your skills in the area of electronic packaging.
www.intel.com/jobs/datacenter
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
- Must be pursuing BS Mechanical Engineering or related discipline.
- Must have the unrestricted right to work in the US without requiring sponsorship
Must have at least 3 months experience in some of the following:
-ProEngineer/Creo (or equivalent 3D modeling software)
-Mechanical design, structural analysis, and empirical methods
-Electronic Packaging thermal design.
-Techniques used for EMI suppression in electronics
-Thermal design of electronic components and assemblies.
-Testing electronic assemblies.
Reference: https://www.linkedin.com/jobs2/view/44939054?trk=jserp_job_details_text
With help from talented employees like you, we will tightly integrate hardware, software and services into compelling experiences in pursuit of our vision. This decade we will create and extend computing technology to connect and enrich the lives of every person on Earth.
About this position...
Intel Fabric Development Organization is seeking a summer engineering intern to join the Mechanical Design team in our King of Prussia design center. As a Mechanical Design Engineering intern, you will be exposed all aspects of the design, prototype, validation and documentation phases of product development. Our products are state of the art, high performance, high reliability, cost effective Fabric Platforms used in High Performance Computing (HPC) industry. HPC systems are used today to help solve some of the world's most challenging scientific needs, including fusion energy, bio-medical research, physics, as well as traditional engineering, such as aeronautic and automotive engineering.
What you will do...
Work with mechanical, electrical, thermal, and other engineering disciplines in developing platform/module/board level electronic hardware.
Evaluate prototypes, perform product validation testing.
Develop product/module design specifications and other documentation.
Support product qualification, compliance and regulatory testing.
Intern will be responsible for an individual project that utilize and grow your skills in the area of electronic packaging.
www.intel.com/jobs/datacenter
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
- Must be pursuing BS Mechanical Engineering or related discipline.
- Must have the unrestricted right to work in the US without requiring sponsorship
Must have at least 3 months experience in some of the following:
-ProEngineer/Creo (or equivalent 3D modeling software)
-Mechanical design, structural analysis, and empirical methods
-Electronic Packaging thermal design.
-Techniques used for EMI suppression in electronics
-Thermal design of electronic components and assemblies.
-Testing electronic assemblies.
Reference: https://www.linkedin.com/jobs2/view/44939054?trk=jserp_job_details_text
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